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| P9 www..com Heatsink Dimensions in mm For capsule devices P9 Features Dimensions in mm 1 17-03-2005 ADR (c) by SEMIKRON P9 www..com Fig.5a Thermal resistance and pressure drop vs.air flow Fig.5b Thermal resistance and pressure drop vs.air flow (per device) Fig.1 Thermal resistance vs.dissipated power Fig.9 Transient thermal impedance vs.time Fig.11a Transient thermal impedance vs.time Fig.11b Transient thermal impedance vs.time 2 17-03-2005 ADR (c) by SEMIKRON P9 www..com Dimensions in mm 3 17-03-2005 ADR (c) by SEMIKRON |
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